Electrodeposition of Cobalt Nanowires 


Vol. 34,  No. 3, pp. 927-930, Mar.  2013
10.5012/bkcs.2013.34.3.927


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  Abstract

We developed an electroplating process of cobalt nanowires of which line-widths were between 70 and 200 nm. The plating electrolyte was made of CoSO4 and an organic additive, dimethyldithiocarbamic acid ester sodium salt (DAESA). DAESA in plating electrolytes had an accelerating effect and reduced the surface roughness of plated cobalt thin films. We obtained void-free cobalt nanowires when the plating current density was 6.25 mA/cm2 and DAESA concentration was 1 mL/L.

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  Cite this article

[IEEE Style]

S. Ahna and K. Hong, "Electrodeposition of Cobalt Nanowires," Bulletin of the Korean Chemical Society, vol. 34, no. 3, pp. 927-930, 2013. DOI: 10.5012/bkcs.2013.34.3.927.

[ACM Style]

Sungbok Ahna and Kimin Hong. 2013. Electrodeposition of Cobalt Nanowires. Bulletin of the Korean Chemical Society, 34, 3, (2013), 927-930. DOI: 10.5012/bkcs.2013.34.3.927.

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ISSN(Print) 0253-2964
ISSN(Online) 1229-5949